H27UBG8T2BTR hynix 32Gb(4096M x 8bit)Legacy MLC NAND Flash
The product part NO.H27UBG8T2BTR-BC is a single 3.3V 32GbitNAND flash memory. The Device contains 2 planes in a single die. Each plane is made up of the 1,024 blocks. Each block consists of 256 programmable pages. Each page contains 8,832bytes. The pages are subdivided into an 8,192byte main data storage area with a spare 640byte district. Page program operation can be performed in typical 1300us, and a single block can be erased in typical 3.5ms.
Feature:
Multi Level Cell(MLC) Technology
■NAND Interface
-x8 bus width
-Multiplexed address/ Data
-Pin-out compatibility for all densities
■Power Supply Voltage
-VCC = 2.7 V ~ 3.6 V
-VCCQ = 2.7 V ~ 3.6 V / 1.7 V ~ 1.95 V
■Organization
-Page size : (8K+640spare)bytes
-Block size : (2048K+160K)bytes
-Plane size : 1024blocks
-Device size : 2048blocks
■Page Read/Program Time
-Random Read Time(tR): 90us(MLC), 40us(SLC)
-Sequential Access: 20 ns (min.)
-Page Program Time: 1300us(MLC), 500us(SLC)
-Parallel operations on both planes available,effectively halving program, read and erase time
■Block Erase
-Block Erase Time: 3.5ms(Typ.)
■Multi-Plane Architecture-Two independent planes architecture
-Parallel operations on both planes available, effectively halving program, read and erase time
■Command Set-ONFI 2.2 Compliant Command Set
-Interleaved CopybackProgram
-Read Unique IDs
■Package
-Package type : TSOP
-Chip count : SDP(1CE, Single) = 1stack
DDP(2CE, Dual) = 2stack
-Pin Count : 48
-Size : 12mm x 20mm x 1.2mm
■Electronic Signature
-1st cycle: Manufacturer Code
-2nd cycle: Device Code
-3rd cycle: Internal chip number, Cell Type, Number of Simultaneously Programmed Pages.
-4th cycle: Page size, Block size, Organization, Spare size
-5th cycle: Multi-plane information
-6th cycle: Technology, EDO, Interface
■Chip Enable Don’t Care
-Simple interface with microcontroller
■Hardware Data Protection
-Program/Erase locked during Power transitions
■Reliability
-TBD